Thermal lag analysis on a simulated TGA-DSC device
- Comesaña, R.
- Gómez, M.A.
- Álvarez, M.A.
- Eguía, P.
Revue:
Thermochimica Acta
ISSN: 0040-6031
Année de publication: 2012
Volumen: 547
Pages: 13-21
Type: Article