Thermally activated dissipation mechanism in Sn doped CuTl-1223 superconductors

  1. Khan, N.A.
  2. Firdous, T.
  3. Kameli, P.
  4. Irfan, M.
  5. Hassan, N.
Revue:
Journal of Materials Science: Materials in Electronics

ISSN: 0957-4522,  1573-482X

Année de publication: 2010

Volumen: 21

Número: 12

Pages: 1308-1312

Type: Article

DOI: 10.1007/S10854-010-0067-1 GOOGLE SCHOLAR

Objectifs de Développement Durable

La source de données: Scopus