Publications dans lesquelles il/elle collabore avec Eduardo Torre Arnanz (11)

2017

  1. Advanced Signal Processing Resources in FPGAs

    FPGAS: FUNDAMENTALS, ADVANCED FEATURES, AND APPLICATIONS IN INDUSTRIAL ELECTRONICS (CRC PRESS-TAYLOR & FRANCIS GROUP), pp. 115-125

  2. Building Reconfigurable Systems Using Commercial FPGAs

    FPGAS: FUNDAMENTALS, ADVANCED FEATURES, AND APPLICATIONS IN INDUSTRIAL ELECTRONICS (CRC PRESS-TAYLOR & FRANCIS GROUP), pp. 197-228

  3. Embedded Processors in FPGA Architectures

    FPGAS: FUNDAMENTALS, ADVANCED FEATURES, AND APPLICATIONS IN INDUSTRIAL ELECTRONICS (CRC PRESS-TAYLOR & FRANCIS GROUP), pp. 59-113

  4. FPGAs Fundamentals, Advanced Features, and Applications in Industrial Electronics Preface

    FPGAS: FUNDAMENTALS, ADVANCED FEATURES, AND APPLICATIONS IN INDUSTRIAL ELECTRONICS

  5. FPGAs and Their Role in the Design of Electronic Systems

    FPGAS: FUNDAMENTALS, ADVANCED FEATURES, AND APPLICATIONS IN INDUSTRIAL ELECTRONICS (CRC PRESS-TAYLOR & FRANCIS GROUP), pp. 1-19

  6. FPGAs: Fundamentals, advanced features, and applications in industrial electronics

    CRC Press, pp. 1-250

  7. Industrial Electronics Applications of FPGAs

    FPGAS: FUNDAMENTALS, ADVANCED FEATURES, AND APPLICATIONS IN INDUSTRIAL ELECTRONICS (CRC PRESS-TAYLOR & FRANCIS GROUP), pp. 229-239

  8. Main Architectures and Hardware Resources of FPGAs

    FPGAS: FUNDAMENTALS, ADVANCED FEATURES, AND APPLICATIONS IN INDUSTRIAL ELECTRONICS (CRC PRESS-TAYLOR & FRANCIS GROUP), pp. 21-57

  9. Mixed-Signal FPGAs

    FPGAS: FUNDAMENTALS, ADVANCED FEATURES, AND APPLICATIONS IN INDUSTRIAL ELECTRONICS (CRC PRESS-TAYLOR & FRANCIS GROUP), pp. 127-142

  10. Off-Chip and In-Chip Communications for FPGA Systems

    FPGAS: FUNDAMENTALS, ADVANCED FEATURES, AND APPLICATIONS IN INDUSTRIAL ELECTRONICS (CRC PRESS-TAYLOR & FRANCIS GROUP), pp. 181-195

  11. Tools and Methodologies for FPGA-Based Design

    FPGAS: FUNDAMENTALS, ADVANCED FEATURES, AND APPLICATIONS IN INDUSTRIAL ELECTRONICS (CRC PRESS-TAYLOR & FRANCIS GROUP), pp. 143-179